Grandsyn™ LB-G4 Cold High-Density Laminated Cardboard (Cold Pressed)

Main features: is formed by cold temperature and high pressure molding of high-density cardboard and polyester adhesive, with uniform density, high mechanical strength, smooth surface, stable dielectric properties, and low internal stress. Suitable for occasions with high mechanical strength requirements, it has excellent processing performance and dimensional stability.

Conventional thickness: 6-120mm

Conventional size: 2100 * 4200, 3200 * 4200, 2200 * 4400, 1050 * 2000, 1050 * 4000

can be customized within the size range according to customer needs


Application areas: Transformers, reactors, high-voltage switches, motors, rail transportation, aerospace, new energy equipment and other fields.